In the electronics manufacturing industry, SPC (statistical process control) helps determine if the process is in control, measured against the reflow parameters defined by the soldering technologies and component requirements.
Thermal profiling is the act of measuring several points on a circuit board to determine the thermal excursion it takes through the soldering process. This is also known as condensation soldering. The maximum temperature assemblies can reach is limited by the boiling point of the medium. There is no need for any protective gas (e.g. For prototyping or hobbyist use PCBs can be placed in a small oven with a door. In commercial high-volume use, reflow ovens take the form of a long tunnel containing a conveyor belt along which PCBs travel. High energy efficiency due to the high heat transfer coefficient of vapour phase media A reflow oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards.Some advantages of vapour phase soldering are: The liquid used is chosen with a desired boiling point in mind to suit the solder alloy to be reflowed. The heating of the PCBs is sourced by thermal energy emitted by the phase transition of a heat transfer liquid (e. Thus nitrogen ovens typically have nitrogen injection in at all times which decreases defect rates. The nitrogen reflow oven takes a few minutes to reduce Oxygen concentration to acceptable levels within the chamber. This minimizes oxidation of the surfaces to be soldered.
Nitrogen (N 2) is a common gas used for this purpose. Some ovens are designed to reflow PCBs in an oxygen-free atmosphere. Ovens may use a combination of infrared radiative heating and convection heating, and would then be known as 'infrared convection' ovens. This indirect heating using air allows more accurate temperature control than directly heating PCBs by infrared radiation, as PCBs and components vary in infrared absorptance. They may be fan assisted to control the airflow within the oven. From benchtop batch solder reflow ovens to automatic. In infrared reflow ovens, the heat source is normally ceramic infrared heaters above and below the conveyor, which transfer heat to the PCBs by means of radiation.Ĭonvection ovens heat air in chambers, using that air to transfer heat to the PCBs by means of convection and conduction. PCB Unlimited offers various solder reflow ovens with options to accommodate low to high volumes. Types of reflow ovens Infrared and convection ovens
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